National Repository of Grey Literature 2 records found  Search took 0.01 seconds. 
Economic encapsulation for integrated circuits and modules
Kristek, Michal ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This Master´s thesis is about ways of packages of integration circuits and modules. Especially it´s about non-hermetic types of packages. One part of this paper are basic information about packaging and aspects in design of package. Next parts are design of test samples, which are package to epoxide powder material. Based on the results of the tests method, it will propose, where the technology will be used.
Economic encapsulation for integrated circuits and modules
Kristek, Michal ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This Master´s thesis is about ways of packages of integration circuits and modules. Especially it´s about non-hermetic types of packages. One part of this paper are basic information about packaging and aspects in design of package. Next parts are design of test samples, which are package to epoxide powder material. Based on the results of the tests method, it will propose, where the technology will be used.

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